I can also connect you with mechanical engineers to design enclosures for your products. Delivering your project in the shortest possible time and high quality is a guarantee. I can handle your company's product from scratch to production or at any stage you prefer. SI/PI simulations to guarantee high signal quality by decreasing (cross-talk, ringing, ground bounce, impedance mismatch, etc.) and sufficient power rails with low impedance profile.

Thermal analysis to achieve better layout and component placement to avoid failures due to overheating.

ĝesigns based on SOM (I.MX6 REX) and SOC (RK3399).

STM32 microcontroller families (F0, F1, F4, F7).

IoT applications with Esspressf family (WIFI and Bluetooth).

Low-speed interfaces (CAN, LIN, SPI, UART, I2C, I2S).🐌🐌.

High-speed interfaces (PCIe, MIPI-CSI/DSI, FPD-link III, USB3, Ethernet, HDMI).

HDI boards, Controlled impedance transmission lines, differential signaling, and mixed signals design.

Some of these projects are added to my portfolio below. This experience is the outcome of several projects I have been responsible for as a hardware engineer and many freelancing projects for local clients in Israel and Palestine. Highly skilled in SI/PI simulations and thermal analysis, in addition to the ability to manage manufacturing processe. Experienced in the R&D department with full responsibility of setting up project specifications and components selections and designing PCBs (schematic/layout).

Hyperlynx vx